Cov txheej txheem nthuav dav ntawm PCB ntau lawm (2)

Rau, txheej txheej; txheej txheej txheej yog roughly tib yam li txheej txheej txheej txheej txheem ntawm thawj kauj ruam, thiab nws lub hom phiaj yog los pab txhawb cov txheej txheem tom ntej los ua ib lub voj voog.

1. Kev kho mob ua ntej: Ntxuav lub ntsej muag ntawm lub rooj tsavxwm los ntawm kev sib tsoo, sib tsoo thiab ziab kom ua rau cov adhesion ntawm cov zaj duab xis qhuav.

2. Lamination: Muab cov zaj duab xis qhuav rau saum npoo ntawm PCB substrate los npaj rau kev hloov cov duab tom ntej.

3. Raug: UV teeb irradiation yog ua los ua kom cov zaj duab xis qhuav ntawm lub rooj tsavxwm tsim ib lub xeev ntawm polymerization thiab tsis-polymerization.

4. Kev loj hlob: Dissolve cov yeeb yaj kiab qhuav uas tsis yog polymerized thaum lub sij hawm raug, tawm hauv qhov sib txawv.

Xya, Secondary tooj liab thiab etching; Secondary tooj liab plating, etching

1. Ob lub tooj liab: Cov qauv electroplating, cov tshuaj tooj liab yog siv rau qhov chaw uas cov zaj duab xis qhuav tsis npog hauv lub qhov; Nyob rau tib lub sij hawm, cov conductivity thiab tooj liab thickness yog ntxiv, thiab ces tinned los tiv thaiv kev ncaj ncees ntawm cov kab thiab qhov thaum lub sij hawm etching.

2. SES: Cov tooj liab hauv qab ntawm txheej txheej txheej qhuav (dawb zaj duab xis) qhov chaw txuas yog etched los ntawm cov txheej txheem xws li kev tshem tawm zaj duab xis, etching, thiab tin stripping, thiab tam sim no cov txheej txheem txheej txheej sab nrauv tiav.

Yim, daim npog ntsej muag: tuaj yeem tiv thaiv lub rooj tsavxwm, tiv thaiv oxidation thiab lwm yam tshwm sim

1. Kev kho mob ua ntej: pickling, ultrasonic ntxuav thiab lwm yam txheej txheem kom tshem tawm board oxides thiab ua rau kom lub roughness ntawm tooj liab nto.

2. Kev luam ntawv: Npog qhov chaw uas lub rooj tsavxwm PCB tsis tas yuav tsum tau soldered nrog solder resist number case los tiv thaiv thiab insulate.

3. Ua ntej ci: Qhuav cov kuab tshuaj nyob rau hauv daim npog ntsej muag lub ntsej muag thaum lub ntsej muag tawv kom raug.

4. Raug: Solder resist number case yog kho los ntawm UV teeb irradiation, thiab siab molecular polymer yog tsim los ntawm photopolymerization.

5. Kev tsim kho: tshem tawm cov tshuaj sodium carbonate hauv cov kua nplaum uas tsis muaj kuab lom.

6. Tom qab ci: kom tag nrho cov tawv tawv.

Cuaj, Ntawv; luam ntawv

1. Pickling: ntxuav lub ntsej muag ntawm lub rooj tsavxwm, tshem tawm cov oxidation saum npoo kom ntxiv dag zog rau cov adhesion ntawm luam ntawv number case.

2. Cov ntawv nyeem: cov ntawv luam tawm yog yooj yim rau cov txheej txheem vuam tom ntej.

Kaum, Nto kho OSP; sab ntawm lub phaj tooj liab liab yuav tsum tau welded yog coated los tsim cov organic zaj duab xis los tiv thaiv xeb thiab oxidation

Kaum Ib Hlis, Kev Tsim Kho; gong tawm cov duab ntawm lub rooj tsavxwm xav tau los ntawm cov neeg siv khoom, uas yooj yim rau cov neeg siv khoom nqa tawm SMT thaj thiab sib dhos

Kaum ob, Flying sojntsuam kuaj; sim lub voj voog ntawm lub rooj tsavxwm kom tsis txhob muaj qhov tawm ntawm lub rooj tsavxwm luv luv

Kaum peb, FQC; Kev tshuaj xyuas zaum kawg, ua kom tiav cov qauv thiab kev soj ntsuam tag nrho tom qab tag nrho cov txheej txheem tiav

Kaum plaub, ntim, tawm ntawm lub warehouse; Lub tshuab nqus tsev ntim cov khoom tiav PCB lub rooj tsavxwm, ntim thiab xa khoom, thiab ua tiav cov khoom xa tuaj