Lub hauv paus ntsiab lus ntawm Kab rov tav Electroplating tau piav qhia tag nrho hauv ib kab lus!

Nrog rau kev nce qib ntawm microelectronics thev naus laus zis, kev tsim hluav taws xob hluav taws xob tsim hluav taws xob tau txhim kho sai hauv cov kev coj ntawm ntau txheej txheej, txheej txheej, ua haujlwm thiab sib xyaw ua ke. Cov txheej txheem ntsug electroplating ib txwm tsis tuaj yeem ua tau raws li qhov yuav tsum tau ua ntawm cov khoom zoo thiab kev ntseeg siab ntawm kev sib txuas qhov. Kev xav tau. Yog li ntawd, kab rov tav electroplating tshuab tau los ua. Nws yog ib qho txuas ntxiv ntawm kev tsim cov tshuab ntsug electroplating, uas yog, cov tshuab electroplating tshiab tsim los ntawm cov tshuab ntsug electroplating. Niaj hnub no, peb yuav qhia txog lub hauv paus ntsiab lus ntawm kab rov tav electroplating!

Txoj cai ntawm Kab rov tav Plating

Txoj kev thiab txoj cai ntawm kab rov tav electroplating thiab ntsug electroplating yog tib yam. Lawv yuav tsum muaj yin thiab yang ncej. Cov tshuaj tiv thaiv electrode tshwm sim tom qab hluav taws xob, uas ionizes cov khoom tseem ceeb ntawm cov electrolyte, ua rau cov ions zoo ions txav mus rau theem tsis zoo ntawm cov tshuaj tiv thaiv electrode; cov ions tsis zoo them nyiaj txav mus rau theem zoo ntawm cov tshuaj tiv thaiv electrode, uas ua rau cov hlau deposition txheej thiab roj emissions. Vim tias cov txheej txheem hlau tso rau ntawm cathode tau muab faib ua peb theem: cov hlau hydrated ions diffuse mus rau cathode; Cov kauj ruam thib ob yog thaum cov hlau hydrated ions dhau los ntawm cov hluav taws xob ob txheej, lawv maj mam dehydrated thiab adsorbed rau saum npoo ntawm cathode; Qhov thib peb kauj ruam yog adsorb rau saum npoo ntawm cathode. Cov hlau ions nyob rau saum npoo ntawm cathode txais electrons thiab nkag mus rau hauv cov hlau lattice. Vim yog hluav taws xob zoo li qub, txheej txheej no me dua li Helmholtz txheej txheej thiab cuam tshuam los ntawm thermal txav. Kev npaj ntawm cations tsis yog nruj thiab zoo li Helmholtz txheej txheej. Cov txheej no yog hu ua diffusion txheej. Lub thickness ntawm diffusion txheej yog inversely proportional rau qhov txaus tus nqi ntawm lub plating tov. Ntawd yog, qhov nrawm nrawm ntawm cov tshuaj plating, lub thinner thiab thicker lub diffusion txheej. Feem ntau, lub thickness ntawm diffusion txheej yog li ntawm 5-50 microns. Nyob rau hauv qhov chaw deb ntawm lub cathode, lub plating tov los ntawm convection yog hu ua lub ntsiab plating tov. Vim hais tias cov convection ntawm cov tshuaj yuav cuam tshuam rau cov uniformity ntawm lub plating tov concentration. Cov tooj liab ions nyob rau hauv lub diffusion txheej yog thauj mus rau Helmholtz txheej txheej los ntawm diffusion thiab ion tsiv teb tsaws. Cov tooj liab ions nyob rau hauv lub ntsiab plating tov yog thauj mus rau cathode nto los ntawm convection thiab ion tsiv teb tsaws. Nyob rau hauv kab rov tav electroplating txheej txheem, tooj liab ions nyob rau hauv lub plating tov yog thauj mus rau ib ncig ntawm lub cathode nyob rau hauv peb txoj kev los tsim ib tug hluav taws xob ob txheej.

Nyob rau hauv qhov kev txiav txim ntawm hluav taws xob teb, cov ions nyob rau hauv cov tshuaj electroplating yog raug rau electrostatic quab yuam ua rau ion thauj, uas yog hu ua ion migration. Nws tus nqi tsiv teb tsaws yog qhia los ntawm cov qauv hauv qab no: u=zeoE/6πrη xav tau. Qhov twg u yog ion tsiv teb tsaws tus nqi, z yog tus nqi ntawm ion, eo yog tus nqi ntawm ib lub tshuab hluav taws xob (piv txwv li 1.61019C), E yog lub peev xwm hluav taws xob, r yog lub vojvoog ntawm hydrated ion, thiab η yog qhov viscosity ntawm cov tshuaj electroplating. Raws li kev suav ntawm qhov sib npaug, nws tuaj yeem pom tias qhov ntau dua qhov muaj peev xwm E poob, qhov viscosity ntawm cov tshuaj electroplating qis dua, thiab qhov ceev ntawm ion migration rate.

Lub convection ntawm cov tshuaj plating yog tshwm sim los ntawm sab nraud thiab sab hauv tshuab nplawm thiab twj tso kua mis stirring, oscillation los yog kev sib hloov ntawm cov electrode nws tus kheej, thiab ntws ntawm cov plating tov los ntawm qhov kub thiab txias sib txawv. Nyob rau ntawm txoj hauj lwm ze rau ntawm qhov chaw ntawm cov khoom electrode, vim nws cov kev sib txhuam tsis sib haum, cov dej ntws ntawm cov electroplating yuav qeeb thiab qeeb, thiab qhov convection tshaj tawm ntawm cov khoom electrode yog xoom. Cov txheej txheem gradient uas tsim los ntawm cov electrode nto mus rau qhov convection zawj yog hu ua flow interface txheej. Lub thickness ntawm cov txheej txheem ntws yog kwv yees li 10 npaug ntawm cov txheej txheem diffusion, yog li cov ion thauj hauv cov txheej txheem diffusion tsis yog cuam tshuam los ntawm convection.

Raws li txoj kev xav ntawm electrodeposition, thaum lub sij hawm electroplating txheej txheem, luam tawm Circuit Court board ntawm lub cathode yog ib tug tsis zoo tagnrho polarized electrode. Cov tooj liab ions adsorbed rau ntawm qhov chaw ntawm cathode nce electrons thiab raug txo rau tooj liab atoms, uas txo cov concentration ntawm tooj liab ions ze ntawm cathode. Yog li ntawd, tooj liab ion concentration gradient yog tsim nyob ze ntawm lub cathode. Cov tshuaj plating uas nws cov tooj liab ion concentration yog qis dua li ntawm cov ntsiab lus plating yog cov txheej txheej ntawm cov tshuaj plating. Lub siab tooj liab ion concentration nyob rau hauv lub ntsiab plating tov yuav diffuse mus rau qhov tsawg tooj liab ion concentration nyob ze ntawm lub cathode, tas li replenishing cheeb tsam cathode. Cov ntawv luam tawm Circuit Board yog zoo ib yam li lub tiaj tus cathode, thiab kev sib raug zoo ntawm qhov loj ntawm qhov tam sim no thiab lub thickness ntawm diffusion txheej yog qhov sib npaug ntawm COTTRELL:

Qhov twg kuv yog tam sim no, z yog tus nqi ntawm tooj liab ions, F yog Faraday tas li, A yog thaj chaw cathode, D yog tooj liab ion diffusion coefficient (D=KT/6πrη), Cb yog tooj liab ion concentration nyob rau hauv lub ntsiab plating tov, thiab Co yog lub cathode Lub concentration ntawm tooj liab ions nyob rau saum npoo, D yog lub thickness ntawm diffusion txheej, K yog lub Bowman tas li (K=R / N), T yog Qhov kub, r yog lub vojvoog ntawm tooj liab hydrate ion, thiab η yog qhov viscosity ntawm cov tshuaj electroplating. Thaum cov tooj liab ion concentration ntawm lub cathode nto yog xoom, nws tam sim no hu ua limiting diffusion tam sim no ii:

Txoj cai ntawm Kab rov tav Plating

Tus yuam sij rau PCB electroplating yog yuav ua li cas los xyuas kom meej qhov sib xws ntawm tooj liab txheej thickness ntawm ob sab ntawm lub substrate thiab sab hauv phab ntsa ntawm lub qhov. Txhawm rau kom tau txais qhov sib xws ntawm txheej txheej, nws yog ib qho tsim nyog yuav tsum xyuas kom meej tias qhov ntws ntawm cov tshuaj plating ntawm ob sab ntawm cov ntawv luam tawm thiab hauv qhov los ntawm qhov yuav tsum ceev thiab zoo ib yam kom tau txais cov txheej nyias nyias thiab sib txawv. Txhawm rau kom tau txais cov txheej txheem nyias nyias thiab tsis sib xws, raws li cov qauv kab rov tav electroplating tam sim no, txawm hais tias muaj ntau lub nozzles tau nruab rau hauv lub cev, nws tuaj yeem nrawm thiab vertically txau cov tshuaj plating rau hauv cov ntawv luam tawm, yog li ua kom cov txheej txheem plating hauv cov txheej txheem. qhov los ntawm qhov Yog li ntawd, tus nqi ntws ntawm cov tshuaj plating yog ceev heev, thiab ib tug vortex yog tsim nyob rau hauv lub Upper thiab qis qhov chaw ntawm lub substrate thiab los ntawm lub qhov, yog li ntawd lub diffusion txheej yog txo thiab ntau uniform. Txawm li cas los xij, nyob rau hauv ib txwm muaj xwm txheej, thaum cov tshuaj plating dheev ntws mus rau hauv qhov nqaim los ntawm lub qhov, cov tshuaj plating ntawm qhov nkag ntawm qhov los ntawm qhov yuav rov qab rov qab. Tsis tas li ntawd, vim muaj kev cuam tshuam ntawm thawj qhov kev faib tawm tam sim no thiab cov txiaj ntsig ntawm lub taub hau, lub thickness ntawm cov tooj liab txheej ntawm lub qhov nkag yog tuab heev, thiab cov phab ntsa sab hauv ntawm lub qhov los ntawm lub qhov ua rau aub-pob txha tooj liab txheej. Raws li lub xeev ntws ntawm lub plating tov nyob rau hauv lub los ntawm lub qhov, uas yog, qhov luaj li cas ntawm eddy tam sim no thiab reflow, thiab lub xeev kev soj ntsuam ntawm qhov zoo ntawm cov conductive plating los ntawm lub qhov, kev tswj tsis tau tsuas yog txiav txim los ntawm tus txheej txheem xeem. txoj kev ua kom tau raws li qhov sib xws ntawm plating thickness ntawm lub rooj tsavxwm luam tawm. Txij li qhov loj ntawm eddy tam sim no thiab backflow tsis tuaj yeem xam qhov kev xav, tsuas yog siv cov txheej txheem ntsuas. Nws tuaj yeem pom los ntawm kev ntsuas cov txiaj ntsig uas txhawm rau txhawm rau tswj qhov sib xws ntawm tooj liab plating thickness ntawm lub qhov los ntawm qhov, nws yog ib qho tsim nyog yuav tsum tau kho cov txheej txheem tswj tau raws li qhov sib piv ntawm qhov dhau-qhov ntawm lub rooj tsav xwm luam tawm. . Txoj kev siv hluav taws xob yog thim rov qab mem tes tam sim no electroplating kom tau txais tooj liab plating nrog muaj peev xwm xa tawm muaj zog.

Nws tuaj yeem pom los ntawm cov qauv saum toj no uas qhov txwv tsis pub tshaj tawm tam sim no yog txiav txim siab los ntawm tooj liab ion concentration ntawm cov ntsiab lus plating, diffusion coefficient ntawm tooj liab ions thiab thickness ntawm diffusion txheej. Thaum lub concentration ntawm tooj liab ions nyob rau hauv lub ntsiab plating tov yog siab, lub diffusion coefficient ntawm tooj liab ions yog loj, thiab lub thickness ntawm diffusion txheej yog nyias, txwv diffusion tam sim no ntau dua. Raws li cov qauv saum toj no, nws paub tias txhawm rau ua tiav qhov kev txwv siab dua tam sim no, cov txheej txheem tsim nyog yuav tsum tau ua, uas yog, cov txheej txheem cua sov yuav tsum tau txais. Vim hais tias qhov kub thiab txias tuaj yeem ua rau cov diffusion coefficient nce, nce qhov convection tuaj yeem ua rau nws muaj vortex thiab tau txais cov txheej nyias nyias. Los ntawm cov kev tshawb fawb saum toj no, ua kom cov concentration ntawm tooj liab ions nyob rau hauv lub ntsiab plating tov, ua rau kom qhov kub thiab txias ntawm lub plating tov, thiab ua kom lub convection tus nqi yuav ua rau kom lub limiting diffusion tam sim no thiab ua tiav lub hom phiaj ntawm accelerating lub plating tus nqi. Kab rov tav electroplating yog raws li qhov ceev ntawm lub convection ceev ntawm cov tshuaj plating los ua eddy tam sim no, uas tuaj yeem txo cov thickness ntawm diffusion txheej mus txog 10 microns. Yog li ntawd, thaum txoj kab rov tav electroplating yog siv rau electroplating, qhov ceev tam sim no yuav siab li 8A / dm2.

Tshwj xeeb tshaj yog nrog kev nce ntawm cov qhov muag tsis pom hauv lub laminate, tsis yog tsuas yog kab rov tav electroplating system yuav tsum tau siv rau electroplating, tab sis kuj ultrasonic vibration yuav tsum tau siv los txhawb kev hloov thiab ncig ntawm cov tshuaj plating hauv qhov dig muag, thiab tom qab ntawd txoj kev siv fais fab yuav tsum tau txhim kho thiab rov qab mem tes tam sim no yuav tsum tau siv. Kho cov kev tswj tsis tau nrog cov ntaub ntawv sim tiag tiag.

Kab rov tav electroplating yog ib txoj kev electroplating tsim raws li ntsug electroplating. Los ntawm ib qho kev pom, nws yog qhov zoo tshaj plaws thiab txuas ntxiv ntawm ntsug electroplating. Yog li ntawd, nws yog ib qho tseem ceeb heev kom nkag siab txog lub hauv paus ntsiab lus ntawm kab rov tav electroplating. Kuv vam tias tsab xov xwm no tuaj yeem muab kev pab rau koj!