RE3200 AI Vision Intelligent Computing Chip Rau Edge AI Daim Ntawv Thov

Qhov Zoo Tshaj Plaws

• Kev sib koom ua ke zoo heev ua ke nrog CPU, AI, yees duab, suab, thiab kev ruaj ntseg subsystems
• Multi-core heterogeneous xam rau kev ua hauj lwm sib luag thiab kev tsim cov peev txheej ntse
• Configurable hardware acceleration modules los txhawb kev tsim kho

AI & Kev Ua Haujlwm

• Kev koom ua ke rau siab AI accelerator xa mus txog 0.6 TOPS
• Txhawb nqa cov qauv kev kawm sib sib zog nqus rau lub sijhawm tiag tiag - lub sijhawm pom kev xav
• Optimized fais fab kev tsim ua tiav txog li 300% kev txhim kho hauv kev ua haujlwm ntawm kev suav
• Ib txwm ultra- lub zog qis ua haujlwm rau ib txwm- ntawm ntug khoom

Kev siv fais fab

• Peak zog noj:<45 mA @ 25°C
• Hom pw tsaug zog (GPIO lossis timer wake-up):<10 µA

Interfaces & Kev sib txuas

• Kev txhawb nqa nplua nuj nrog rau MIPI-CSI, HDMI, USB 3.0, thiab Ethernet
• Yooj yim I/O configuration kom tau raws li ntau hom kev sib koom ua ke

Kev ntseeg tau & kev ua haujlwm

• ambient kub: -40 ℃ to 85 ℃
• Qhov kub thiab txias: -40 ℃ to 125 ℃
• ESD tiv thaiv: 4 kV (HBM)
• Latch- nce kev tiv thaiv: 200 mA

Txheej Txheem & Ntim

• 55nm qis- cov txheej txheem fais fab (1P7M)
• QFN40L pob, 5 hli × 5 hli × 0.75 hli, 0.4 hli suab

Fais fab mov

• Ib qho sab nraud 3.3V mov (3.0V-3.6V)
• Integrated 3.3 V-1.2 V thiab 3.3 V-1.8 V LDOs

Daim phiaj siv

• Ntse soj ntsuam systems
• Kev thauj mus los ntse
• Kev lag luam tshuab pom
• Ntse tsev thiab IoT khoom siv

Cim npe nrov: re3200 ai vision ntse xam nti rau ntug ai daim ntaub ntawv, Tuam Tshoj, Hoobkas, customized, kev